Invention Grant
- Patent Title: Memory device and manufacturing method thereof
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Application No.: US17698748Application Date: 2022-03-18
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Publication No.: US11804529B2Publication Date: 2023-10-31
- Inventor: Yu-Chu Lin , Chi-Chung Jen , Chia-Ming Pan , Su-Yu Yeh , Keng-Ying Liao , Chih-Wei Sung
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/66 ; H01L21/28 ; H01L29/788 ; H10B41/30

Abstract:
A method includes depositing a gate dielectric film over a substrate. A floating gate layer and a control gate layer are deposited over the gate dielectric film. The control gate layer is patterned to form a control gate over the floating gate layer. A top portion of the floating gate layer is patterned. A spacer structure is formed on a sidewall of the control gate and over a remaining portion of the floating gate layer. The remaining portion of the floating gate layer is patterned to form a bottom portion of a floating gate. A ratio of the bottom width of the bottom portion to the middle width of the bottom portion is in a range between about 103% and about 108%. The gate dielectric film is patterned form a gate dielectric layer.
Public/Granted literature
- US20220216315A1 MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-07-07
Information query
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