Invention Grant
- Patent Title: Laser machining device
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Application No.: US17162510Application Date: 2021-01-29
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Publication No.: US11806812B2Publication Date: 2023-11-07
- Inventor: Masatoshi Nishio , Jingbo Wang , Hitoshi Nishimura , Motoki Morioka
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 18148541 2018.08.07
- Main IPC: B23K26/70
- IPC: B23K26/70 ; B23K26/082 ; B23K26/06 ; B23K26/38
Abstract:
A detector is configured to detect an output of a reflected beam from an exit end surface of a parallel plate. A determination unit is configured to determine that an abnormality occurs in the parallel plate when a detection value of the detector is smaller than a determination threshold.
Public/Granted literature
- US20210146481A1 LASER MACHINING DEVICE Public/Granted day:2021-05-20
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