Laser processing device and laser processing method using same

    公开(公告)号:US12263541B2

    公开(公告)日:2025-04-01

    申请号:US17527495

    申请日:2021-11-16

    Abstract: A laser processing device includes a laser oscillator, optical fiber (90), beam control mechanism (20), and a laser light emitting head. The laser oscillator includes first and second laser oscillation units that generate first and second laser light rays (LB1) and (LB2), respectively. Beam control mechanism (20) includes optical path changing and holding mechanism (40) that is disposed between second condenser lens (32) that condenses second laser light (LB2) and dichroic mirror (33) that multiplexes first and second laser light rays (LB1) and (LB2) and causes the multiplexed light to be incident on optical fiber (90). Beam control mechanism (20) changes an incident position of second laser light (LB2) on optical fiber (90).

    Laser welding device with changing focal position and laser welding method using same

    公开(公告)号:US12296405B2

    公开(公告)日:2025-05-13

    申请号:US17541166

    申请日:2021-12-02

    Abstract: Laser welding device (1000) includes: laser oscillator (100); optical fiber (300) that transmits a laser beam (LB) generated in laser oscillator (100); laser beam emitting head (400) that is attached to the emission end of optical fiber (300) and emits laser beam (LB) toward workpiece (600); manipulator (500) with laser beam emitting head (400) attached thereto; and controller (200) that controls laser beam emitting head (400) so as to cause laser beam (LB) to be scanned three-dimensionally on the surface of workpiece (600). Controller (200) controls laser beam emitting head (400) so as to change a focal position of laser beam (LB) in accordance with a shape of a welded portion in workpiece (600).

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