Invention Grant
- Patent Title: Standalone thermal chamber for a temperature control component
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Application No.: US17976607Application Date: 2022-10-28
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Publication No.: US11808803B2Publication Date: 2023-11-07
- Inventor: Daniel G. Scobee , Aleksandr Semenuk , Aswin Thiruvengadam
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H05K7/20 ; H05K1/18

Abstract:
A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.
Public/Granted literature
- US20230046331A1 STANDALONE THERMAL CHAMBER FOR A TEMPERATURE CONTROL COMPONENT Public/Granted day:2023-02-16
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