- 专利标题: Double-sided cooling type power module and manufacturing method therefor
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申请号: US16982431申请日: 2018-10-19
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公开(公告)号: US11810887B2公开(公告)日: 2023-11-07
- 发明人: Heoncheol Oh , Jaesang Min , Yonghee Park , Jinwoo Lee , Heejin Cho
- 申请人: LG Electronics Inc.
- 申请人地址: KR Seoul
- 专利权人: LG Electronics Inc.
- 当前专利权人: LG Electronics Inc.
- 当前专利权人地址: KR Seoul
- 代理机构: Fish & Richardson P.C.
- 优先权: KR 20180032267 2018.03.20
- 国际申请: PCT/KR2018/012402 2018.10.19
- 国际公布: WO2019/182216A 2019.09.26
- 进入国家日期: 2020-09-18
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L23/373 ; H02M7/00
摘要:
A power module includes a first substrate including a first metal plate, a second substrate spaced apart from the first substrate and having a second metal facing the first substrate, a plurality of power elements that are disposed between the first substrate and the second substrate and include a first electrode and a second electrode. The plurality of power elements include a first power element having the first electrode bonded to the second metal plate, and a second power element having the first electrode bonded to the first metal plate.
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