公开(公告)号：US12080674B2

公开(公告)日：2024-09-03

申请号：US18375761

申请日：2023-10-02

申请人： LG Electronics Inc.

发明人： Heoncheol Oh ,  Jaesang Min ,  Yonghee Park ,  Jinwoo Lee ,  Heejin Cho

IPC分类号： H01L23/00 ,  H01L23/373 ,  H02M7/00

CPC分类号： H01L24/32 ,  H01L23/3735 ,  H02M7/003

摘要： A power module includes: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, where the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.

公开(公告)号：US11810887B2

公开(公告)日：2023-11-07

申请号：US16982431

申请日：2018-10-19

申请人： LG Electronics Inc.

发明人： Heoncheol Oh ,  Jaesang Min ,  Yonghee Park ,  Jinwoo Lee ,  Heejin Cho

IPC分类号： H01L23/00 ,  H01L23/373 ,  H02M7/00

CPC分类号： H01L24/32 ,  H01L23/3735 ,  H02M7/003

摘要： A power module includes a first substrate including a first metal plate, a second substrate spaced apart from the first substrate and having a second metal facing the first substrate, a plurality of power elements that are disposed between the first substrate and the second substrate and include a first electrode and a second electrode. The plurality of power elements include a first power element having the first electrode bonded to the second metal plate, and a second power element having the first electrode bonded to the first metal plate.