Invention Grant
- Patent Title: High-frequency module and communication device
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Application No.: US17221014Application Date: 2021-04-02
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Publication No.: US11831299B2Publication Date: 2023-11-28
- Inventor: Yukiteru Sugaya , Syunsuke Kido , Masanori Kato , Hiroshi Matsubara
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: KEATING & BENNETT, LLP
- Priority: JP 20067939 2020.04.03
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H9/205 ; H03H9/60

Abstract:
A high-frequency module includes a mounting substrate, a filter, and a common inductor. The mounting substrate includes a first main surface and a second main surface facing each other. The filter includes series arm resonators and parallel arm resonators, and is disposed on the first main surface. The mounting substrate includes a ground terminal on the second main surface. A first end of the common inductor is connected to all of the parallel arm resonators. A second end of the common inductor is connected to the ground terminal.
Public/Granted literature
- US20210313962A1 HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-10-07
Information query
IPC分类: