- Patent Title: Semiconductor device package and a method of manufacturing the same
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Application No.: US17537317Application Date: 2021-11-29
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Publication No.: US11837557B2Publication Date: 2023-12-05
- Inventor: Peng Yang , Yuan-Feng Chiang , Po-Wei Lu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L23/16 ; H01L23/31 ; H01L23/538
Abstract:
A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.
Public/Granted literature
- US20220084958A1 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-03-17
Information query
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