Invention Grant
- Patent Title: Magnetic current sensor integration into high current connector device
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Application No.: US17487314Application Date: 2021-09-28
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Publication No.: US11841383B2Publication Date: 2023-12-12
- Inventor: Theodor Kranz , Ramdas Ugale , Gaetano Formato , Sebastian Maerz , Dietmar Spitzer
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Main IPC: G01R15/20
- IPC: G01R15/20 ; H01R4/30 ; G01R19/10 ; H02K5/22 ; H02K11/27

Abstract:
A power connector is provided that is configured to conduct a current. The power connector includes a base structure, an extension structure, and a connector head structure that define a current path for the current. The base structure is coupled to an output node of a primary conductor and receives the current from the primary conductor. The connector head structure is configured to output the current from the power connector to the load. The extension structure is coupled to and extends between the base structure and the connector head structure. The extension structure includes a current constriction region configured to increase a magnetic flux density of a magnetic field produced by the current flowing through the current constriction region at a position of a magnetic current sensor that generates a sensor signal based on the magnetic field magnetic field produced by the current flowing through the current constriction region.
Public/Granted literature
- US20230094577A1 MAGNETIC CURRENT SENSOR INTEGRATION INTO HIGH CURRENT CONNECTOR DEVICE Public/Granted day:2023-03-30
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