公开(公告)号：US20240275268A1

公开(公告)日：2024-08-15

申请号：US18632956

申请日：2024-04-11

Applicant: Infineon Technologies AG

Inventor： Tomas Reiter ,  Dietmar Spitzer

IPC: H02M1/32 ,  H02M7/00 ,  H02M7/5387

CPC classification number: H02M1/32 ,  H02M7/003 ,  H02M7/5387

Abstract: A power electronics system includes: a power semiconductor module with opposite first and second sides and lateral sides connecting the first and second sides. The power semiconductor module includes: at least one power semiconductor die forming at least one part of a half bridge circuit, an encapsulation encapsulating the power semiconductor die, and an external contact configured as a current contact of the half bridge circuit and exposed from the encapsulation at a lateral side of the power semiconductor module. A driver module arranged over the first side of the power semiconductor module is configured to control the half bridge circuit. A differential Hall sensor arranged over the external contact is configured to detect a current in the external contact. The driver module is configured to modify a control pattern of the half bridge circuit based on a current value detected by the differential Hall sensor.

公开(公告)号：US20230412066A1

公开(公告)日：2023-12-21

申请号：US18090096

申请日：2022-12-28

Applicant: Infineon Technologies AG

Inventor： Tomas Reiter ,  Dietmar Spitzer

IPC: H02M1/32 ,  H02M7/5387 ,  H02M7/00

CPC classification number: H02M1/32 ,  H02M7/5387 ,  H02M7/003

Abstract: A power electronics system includes: a power semiconductor module with opposite first and second sides and lateral sides connecting the first and second sides. The power semiconductor module includes: at least one power semiconductor die forming at least one part of a half bridge circuit, an encapsulation encapsulating the power semiconductor die, and an external contact configured as a direct current contact of the half bridge circuit and exposed from the encapsulation at a lateral side of the power semiconductor module. A driver module arranged over the first side of the power semiconductor module is configured to control the half bridge circuit. A differential Hall sensor arranged over the external contact is configured to detect a direct current flowing through the external contact. The driver module is configured to modify a control pattern of the half bridge circuit based on a direct current value detected by the differential Hall sensor.

公开(公告)号：US12218578B2

公开(公告)日：2025-02-04

申请号：US18090096

申请日：2022-12-28

Applicant: Infineon Technologies AG

Inventor： Tomas Reiter ,  Dietmar Spitzer

IPC: H02M1/32 ,  H02M7/00 ,  H02M7/5387

Abstract: A power electronics system includes: a power semiconductor module with opposite first and second sides and lateral sides connecting the first and second sides. The power semiconductor module includes: at least one power semiconductor die forming at least one part of a half bridge circuit, an encapsulation encapsulating the power semiconductor die, and an external contact configured as a direct current contact of the half bridge circuit and exposed from the encapsulation at a lateral side of the power semiconductor module. A driver module arranged over the first side of the power semiconductor module is configured to control the half bridge circuit. A differential Hall sensor arranged over the external contact is configured to detect a direct current flowing through the external contact. The driver module is configured to modify a control pattern of the half bridge circuit based on a direct current value detected by the differential Hall sensor.

公开(公告)号：US20230369187A1

公开(公告)日：2023-11-16

申请号：US18314459

申请日：2023-05-09

Applicant: Infineon Technologies AG

Inventor： Andre Arens ,  Jens de Bock ,  Xi Zhang ,  Dietmar Spitzer

IPC: H01L23/498 ,  H01L25/07 ,  H01L21/56 ,  H01L23/31 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L23/49811 ,  H01L25/072 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49838 ,  H05K1/181 ,  H05K1/0213 ,  H05K2201/10151 ,  H05K2201/083

Abstract: A power semiconductor module arrangement includes: a housing; a substrate having a substrate layer and a first metallization layer on a first side of the substrate layer, inside the housing or forming a bottom of the housing; a printed circuit board inside the housing, vertically above and in parallel to the substrate; electrically conducting components on the printed circuit board and substrate; an encapsulant at least partly filling the interior of the housing; and a magnetic field sensor either on the substrate within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the printed circuit board, or on the printed circuit board within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the substrate. The magnetic field sensor is electrically insulated from the respective electrically conducting component.

公开(公告)号：US10222234B2

公开(公告)日：2019-03-05

申请号：US14306442

申请日：2014-06-17

Applicant: Infineon Technologies AG

Inventor： Dietmar Spitzer ,  Peter Slama ,  Harald Witschnig ,  Leo Aichriedler ,  Friedrich Rasbornig

IPC: G01D5/14 ,  G01D5/16 ,  H02K11/215 ,  H02K29/08 ,  G01B7/30 ,  G01D5/245 ,  G01D5/246 ,  G01B7/315 ,  H02K11/21 ,  H02K29/06

Abstract: A sensor device is provided with a magnetic field sensitive element being positioned in a magnetic field of a magnet. The magnet is positioned on an end face of a shaft. The magnetic field sensitive element is configured to sense an orientation angle of the magnetic field in the range between 0° and 360°. The shaft is one of a shaft of a transmission of a vehicle or a shaft of a brushless DC motor or a shaft of a wheel axle of a vehicle.

公开(公告)号：US20230123783A1

公开(公告)日：2023-04-20

申请号：US17959458

申请日：2022-10-04

Applicant: Infineon Technologies AG

Inventor： Tomas Reiter ,  Dietmar Spitzer ,  Christoph Koch ,  Patrik Holt Jones

IPC: G01R15/20 ,  H01L23/373 ,  H01L23/367 ,  H01L23/498 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H02M1/00

Abstract: A semiconductor module includes a semiconductor die, an encapsulation encapsulating the die, and first and second power contacts electrically coupled to the die. The power contacts each include an external part exposed from the encapsulation and an overlapping part. The power contacts are configured to carry respective first and second currents. A current flow of the first current in the external part of the first power contact points into or out of the semiconductor module. A current flow of the second current in the external part of the second power contact points in the opposite direction of the first current flow. The overlapping parts overlap such that the current flows point in the same direction in the overlapping parts. The overlapping parts include overlapping slots configured to accept a current sensor element for measuring a combined current in the overlapping parts.

公开(公告)号：US20230009758A1

公开(公告)日：2023-01-12

申请号：US17368213

申请日：2021-07-06

Applicant: Infineon Technologies AG

Inventor： Tomas Manuel Reiter ,  Christoph Koch ,  Dietmar Spitzer

IPC: G01R15/20 ,  H05K1/18 ,  H02M7/00

Abstract: A power semiconductor module includes: an electrically insulative frame having opposite mounting sides and a border wall that defines a periphery of the frame; a substrate seated in the frame; power semiconductor dies attached to the substrate; signal pins attached to the substrate and electrically connected to the power semiconductor dies; a busbar attached to the substrate and extending through the border wall; a receptable in the border wall configured to receive a current sensor module and that exposes part of the busbar, the exposed part of the busbar having an opening; and a rotation bar jutting out from a sidewall of the receptable and onto the exposed part of the busbar without obstructing the opening in the busbar, wherein the rotation bar forms an axis of rotation within the receptable. A power electronic assembly that incorporates the power semiconductor module and corresponding method of production are also described.

公开(公告)号：US11349265B2

公开(公告)日：2022-05-31

申请号：US17019860

申请日：2020-09-14

Applicant: Infineon Technologies AG

Inventor： Leo Aichriedler ,  Gaetano Formato ,  Dietmar Spitzer ,  Ramdas Ugale

IPC: G01R15/20 ,  H01R13/66

Abstract: A power connector is provided that is configured to conduct a current. The power connector includes a conductive frame including a base structure, an extension structure, and a cap structure that define a connector volume. The base structure is coupled to an output node of a primary conductor and receives the current from the primary conductor. The cap structure is configured to mechanically couple the power connector to a load and outputs the current from the power connector to the load. The extension structure is coupled to and extends between the base structure and the cap structure. The extension structure includes a current constriction region configured to cause a defined magnetic field of the current flowing through the current constriction region at a position of a magnetic current sensor that generates a sensor signal based on the defined magnetic field produced by the current flowing through the current constriction region.

公开(公告)号：US20170315146A1

公开(公告)日：2017-11-02

申请号：US15655443

申请日：2017-07-20

Applicant: Infineon Technologies AG

Inventor： Helmut Koeck ,  Leo Aichriedler ,  Dirk Hammerschmidt ,  Andrea Monterastelli ,  Friedrich Rasbornig ,  Peter Slama ,  Dietmar Spitzer ,  Tobias Werth ,  Harald Witschnig

IPC: G01P3/487 ,  G01D5/14 ,  G01C21/10 ,  G01C25/00 ,  G01L3/10 ,  G01D5/244

CPC classification number: G01P3/487 ,  G01C21/10 ,  G01C25/005 ,  G01D5/145 ,  G01D5/244 ,  G01D5/2454 ,  G01D5/246 ,  G01L3/101

Abstract: A sensor device is provided with a magnetic field sensitive element being positioned in a magnetic field of a magnet. The magnetic field sensitive element is configured to sense an orientation angle of the magnetic field in the range between 0° and 360° and generate a sensing signal. The electronic circuitry is configured to receive and process the sensing signal from the magnetic field sensitive element to generate an angle signal indicating the orientation angle of the magnetic field.

公开(公告)号：US11901675B2

公开(公告)日：2024-02-13

申请号：US17825054

申请日：2022-05-26

Applicant: Infineon Technologies AG

Inventor： Leo Aichriedler ,  Gaetano Formato ,  Dietmar Spitzer ,  Ramdas Ugale

IPC: G01R15/20 ,  H01R13/66

CPC classification number: H01R13/6683 ,  G01R15/202 ,  G01R15/205 ,  G01R15/207

Abstract: A power connector is provided that is configured to conduct a current and includes a conductive frame including a base structure, an extension structure, and a cap structure that define a current path for the current. The base structure is configured to be coupled to a current supply for receiving the current therefrom. The cap structure is configured to be coupled to an electrical interface of a device to be supplied with the current and outputs the current from the connector to the electrical interface of the device. The extension structure is coupled to and vertically extends between the base structure and the cap structure. The extension structure includes a current constriction region that is configured to cause a defined magnetic field of the current flowing through the current constriction region at a predefined position.