Invention Grant
- Patent Title: Method and apparatus for adaptive alignment
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Application No.: US17659467Application Date: 2022-04-15
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Publication No.: US11842420B2Publication Date: 2023-12-12
- Inventor: Wei Fang , Lingling Pu
- Applicant: ASML Netherlands B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: G06T7/33
- IPC: G06T7/33 ; G06T7/73 ; G06T7/13 ; G06T7/00 ; H01L21/67 ; H01L21/66

Abstract:
A method for aligning a wafer image with a reference image, comprising: searching for a targeted reference position on the wafer image for aligning the wafer image with the reference image; and in response to a determination that the targeted reference position does not exist: defining a current lock position and an area that encloses the current lock position on the wafer image; computing an alignment score of the current lock position; comparing the alignment score of the current lock position with stored alignment scores of positions previously selected in relation to aligning the wafer image with the reference image; and aligning the wafer image with the reference image based on the comparison.
Public/Granted literature
- US20220245840A1 METHOD AND APPARATUS FOR ADAPTIVE ALIGNMENT Public/Granted day:2022-08-04
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