- 专利标题: Multilayer electronic component
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申请号: US17707384申请日: 2022-03-29
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公开(公告)号: US11842856B2公开(公告)日: 2023-12-12
- 发明人: Hye Won Kim , Won Kuen Oh , Chae Dong Lee , Og Soon Kim , Jung Won Park
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20210194081 2021.12.31
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/12 ; H01G4/012 ; H01G4/008
摘要:
A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.
公开/授权文献
- US20230215649A1 MULTILAYER ELECTRONIC COMPONENT 公开/授权日:2023-07-06
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