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公开(公告)号：US11842856B2
公开(公告)日：2023-12-12
申请号：US17707384
申请日：2022-03-29
发明人： Hye Won Kim , Won Kuen Oh , Chae Dong Lee , Og Soon Kim , Jung Won Park
摘要： A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.
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公开(公告)号：US20230215630A1
公开(公告)日：2023-07-06
申请号：US17984881
申请日：2022-11-10
发明人： Og Soon Kim , Chae Dong Lee , Hye Won Kim , Jung Won Park
CPC分类号： H01G4/008 , B32B27/08 , B32B27/302 , B32B5/16 , B32B27/38 , H01G4/30 , B32B2307/204 , B32B2307/202 , B32B2264/105 , B32B2457/16
摘要： A multilayer electronic component includes: a body and an external electrode disposed on the body, wherein the external electrode includes a conductive resin layer containing a bisphenol A-based resin and a biphenyl-based resin with a specific mixing ratio (e.g., a ratio of a content of the biphenyl-based resin with respect to a total content is 10 wt % or more and 50 wt % or less). Such a resin mixing ratio between the bisphenol A-based resin and the biphenyl-based resin can lead to 0.337≤2*C/A≤0.367 or 0.048≤B/A≤0.14, with an aromatic ring peak intensity (A), a carbonyl peak intensity (B), and an alcohol peak intensity (C) in a Fourier transform infrared spectroscopy (FT-IR) analysis. The multilayer electronic component showing such peak intensity characteristics can suppress oxidation of a conductive resin layer while also securing excellent adhesive strength of the conductive resin layer.
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公开(公告)号：US11915875B2
公开(公告)日：2024-02-27
申请号：US17725857
申请日：2022-04-21
发明人： Chae Dong Lee , Og Soon Kim , Hye Won Kim , Jung Won Park
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.
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