Invention Grant
- Patent Title: Integrating control circuits with light emissive circuits with dissimilar wafer sizes
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Application No.: US17193855Application Date: 2021-03-05
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Publication No.: US11842989B2Publication Date: 2023-12-12
- Inventor: Rajendra D. Pendse
- Applicant: Meta Platforms Technologies, LLC
- Applicant Address: US CA Menlo Park
- Assignee: Meta Platforms Technologies, LLC
- Current Assignee: Meta Platforms Technologies, LLC
- Current Assignee Address: US CA Menlo Park
- Agency: Jordan IP Law, LLC
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L33/00 ; G06F1/16 ; H01L21/683 ; H01L25/075 ; H01L33/52 ; H01L33/62 ; G02B27/01

Abstract:
In some examples, an article comprises a semiconductor including at least one integrated circuit and an inorganic semiconductor layer bonded to a first surface of the semiconductor. The inorganic semiconductor layer comprises a μLED array, and the first surface of the semiconductor extends beyond a first edge of the inorganic semiconductor layer. The first edge of the inorganic semiconductor layer is oriented substantially perpendicular to the first surface of the semiconductor.
Public/Granted literature
- US20210288032A1 INTEGRATING CONTROL CIRCUITS WITH LIGHT EMISSIVE CIRCUITS WITH DISSIMILAR WAFER SIZES Public/Granted day:2021-09-16
Information query
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