Invention Grant
- Patent Title: Conveyance system for transferring frame wafer
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Application No.: US17788647Application Date: 2020-09-23
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Publication No.: US11851289B2Publication Date: 2023-12-26
- Inventor: Hiroaki Nakamura , Toshihiro Kawai , Kosuke Sugiura , Gengoro Ogura , Yasushi Taniyama
- Applicant: Sinfonia Technology Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Sinfonia Technology Co., Ltd.
- Current Assignee: Sinfonia Technology Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP 19238136 2019.12.27
- International Application: PCT/JP2020/035693 2020.09.23
- International Announcement: WO2021/131186A 2021.07.01
- Date entered country: 2022-06-23
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65G47/90 ; H01L21/67 ; H01L21/687

Abstract:
A conveyance system discriminates the front and back of a frame wafer without human intervention. A frame is partially formed asymmetrically with respect to a predetermined center line when viewed in a direction orthogonal to a surface of a wafer. The conveyance system includes a hand configured to hold the frame so that the frame extends in a predetermined virtual plane, a first sensor configured to detect a portion of the frame held on the hand and located in a predetermined first region in the virtual plane, a second sensor configured to detect a portion of the frame held on the hand and located in a second region opposite to the first region across the center line, and a controller configured to determine the front and back of the frame wafer based on a detection result obtained by the first sensor and a detection result obtained by the second sensor.
Public/Granted literature
- US20230033168A1 CONVEYANCE SYSTEM Public/Granted day:2023-02-02
Information query
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