Embodiments include semiconductor packages and a method to form such packages. A semiconductor package includes first and second bottom dies on a package substrate. The semiconductor package includes first top dies on the first bottom die, second top dies on the second bottom die, and a pedestal on the first and second bottom dies. The pedestal comprises a high thermal conductive material and is positioned on a region of top surfaces of the first and second bottom dies. The semiconductor package includes an encapsulation layer over the first and second bottom dies, and surrounds the first and second top dies and the pedestal. The semiconductor package includes a TIM over the first and second top dies, pedestal, and encapsulation layer, and an integrated heat spreader (IHS) over the TIM. The pedestal is on a periphery region of the top surfaces of the first and second bottom dies.