Invention Grant
- Patent Title: Integrated circuits with FinFET gate structures
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Application No.: US17856471Application Date: 2022-07-01
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Publication No.: US11855084B2Publication Date: 2023-12-26
- Inventor: Kuo-Cheng Ching , Huan-Chieh Su , Zhi-Chang Lin , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- The original application number of the division: US16360502 2019.03.21
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L21/033 ; H01L21/8234

Abstract:
Examples of an integrated circuit with FinFET devices and a method for forming the integrated circuit are provided herein. In some examples, an integrated circuit device includes a substrate, a fin extending from the substrate, a gate disposed on a first side of the fin, and a gate spacer disposed alongside the gate. The gate spacer has a first portion extending along the gate that has a first width and a second portion extending above the first gate that has a second width that is greater than the first width. In some such examples, the second portion of the gate spacer includes a gate spacer layer disposed on the gate.
Public/Granted literature
- US20220336452A1 Integrated Circuits with FinFET Gate Structures Public/Granted day:2022-10-20
Information query
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