Invention Grant
- Patent Title: Measurement device
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Application No.: US17976612Application Date: 2022-10-28
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Publication No.: US11859969B2Publication Date: 2024-01-02
- Inventor: Hideki Morii , Takuya Inoue
- Applicant: Tokyo Seimitsu Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: TOKYO SEIMITSU CO., LTD.
- Current Assignee: TOKYO SEIMITSU CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 20080058 2020.04.30
- Main IPC: G01B5/00
- IPC: G01B5/00 ; G01B3/00 ; G01B3/56 ; G01B5/14 ; G01B5/20 ; G01B5/28

Abstract:
A measurement device includes: a probe part including a probe configured to measure a surface of an object to be measured and is attached so as to swing around a swing center according to a shape of the surface of the object to be measured; a scale configured to measure displacement by swinging of the probe part; a scale head configured to read a scale mark of the scale; and an arm part to which the probe part is attached, the arm part is attached so as to swing around the swing center integrally with the probe part, and the scale is attached to the arm part. When thermal expansion coefficients of the probe part, the arm part and the scale are α, β and γ respectively, the measurement device satisfies a condition of (α+γ)−1/2α≤β≤(α+γ)+1/2α.
Public/Granted literature
- US20230052870A1 MEASUREMENT DEVICE Public/Granted day:2023-02-16
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