Invention Grant
- Patent Title: Dual wavelength distributed temperature sensing with built-in fiber integrity monitoring
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Application No.: US17566361Application Date: 2021-12-30
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Publication No.: US11860041B2Publication Date: 2024-01-02
- Inventor: Andre Champavere
- Applicant: VIAVI SOLUTIONS INC.
- Applicant Address: US CA San Jose
- Assignee: VIAVI SOLUTIONS INC.
- Current Assignee: VIAVI SOLUTIONS INC.
- Current Assignee Address: US AZ Chandler
- Agency: Mannava & Kang, P.C.
- Priority: FR 57219 2018.08.01
- The original application number of the division: US16119807 2018.08.31
- Main IPC: G01K11/3206
- IPC: G01K11/3206 ; G01D5/353 ; G01K1/00 ; G01K3/14 ; G01K11/324 ; H01S3/23

Abstract:
In some examples, a temperature distribution sensor may include a laser source to emit a laser beam that is tunable to a first wavelength and a second wavelength for injection into a device under test (DUT). A first wavelength optical receiver may convert a return signal corresponding to the first wavelength with respect to Rayleigh backscatter or Raman backscatter Anti-Stokes. A second wavelength optical receiver may convert the return signal corresponding to the second wavelength with respect to Rayleigh backscatter or Raman backscatter Stokes. Bending loss associated with the DUT may be determined by utilizing the Rayleigh backscatter signal corresponding to the first wavelength and the Rayleigh backscatter signal corresponding to the second wavelength. Further, temperature distribution associated with the DUT may be determined by utilizing the Raman backscatter Anti-Stokes signal corresponding to the first wavelength and the Raman backscatter Stokes signal corresponding to the second wavelength.
Public/Granted literature
- US20220120622A1 DUAL WAVELENGTH DISTRIBUTED TEMPERATURE SENSING WITH BUILT-IN FIBER INTEGRITY MONITORING Public/Granted day:2022-04-21
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