Invention Grant
- Patent Title: Device and method for ascertaining a mechanical stress component by means of a hall sensor circuit
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Application No.: US17303055Application Date: 2021-05-19
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Publication No.: US11860047B2Publication Date: 2024-01-02
- Inventor: Mario Motz
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Priority: DE 2020206571.3 2020.05.26
- Main IPC: G01R33/07
- IPC: G01R33/07 ; G01L1/12 ; G01R15/20 ; G01R19/00

Abstract:
The subject matter described herein relates to a semiconductor circuit arrangement with a semiconductor substrate with an integrated Hall sensor circuit. During a first clock phase PHspin1 a first electrical voltage signal ±VHallout(PHspin1) or ±VHallbias(PHspin1) can be generated in the Hall effect region that has a first dependency on a mechanical stress of the semiconductor substrate. During a second clock phase PHspin2 a second electrical voltage signal ±VHallout(PHspin2) or ±VHallbias(PHspin2) can be generated in the Hall effect region that has a second dependency on a mechanical stress of the semiconductor substrate. The semiconductor circuit arrangement is designed to ascertain a specific mechanical stress component based on a combination of the first electrical voltage signal ±VHallout(PHspin1) or ±VHallbias(PHspin1) and of the second electrical voltage signal ±VHallout(PHspin2) or ±VHallbias(PHspin2).
Public/Granted literature
- US20210372865A1 DEVICE AND METHOD FOR ASCERTAINING A MECHANICAL STRESS COMPONENT BY MEANS OF A HALL SENSOR CIRCUIT Public/Granted day:2021-12-02
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