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公开(公告)号：US12163808B2
公开(公告)日：2024-12-10
申请号：US18519430
申请日：2023-11-27
Applicant: Infineon Technologies AG
Inventor： Mario Motz , Amirhossein Jouyaeian , Kofi Makinwa
Abstract: The described techniques address issues associated with hybrid current or magnetic field sensors used to detect both low- and high-frequency magnetic field components. The hybrid sensor implements a DC component rejection path in the high-frequency magnetic field component path. Both digital and analog implementations are provided, each functioning to generate a DC component cancellation signal to at least partially cancel a DC component of a current signal generated via the high-frequency magnetic field component path. The hybrid sensor provides a high-bandwidth, high-accuracy, and low DC offset hybrid current solution that also eliminates the need for DC decoupling capacitors in the high-frequency path. A modification is also described for implementing a Sigma-Delta (ΣΔ) quantization noise reduction path to reduce the quantization noise and to improve accuracy.
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公开(公告)号：US11863137B2
公开(公告)日：2024-01-02
申请号：US17302435
申请日：2021-05-03
Applicant: Infineon Technologies AG
Inventor： Mario Motz , Umberto Aracri
CPC classification number: H03F3/38 , G01R33/075 , H03F2200/459 , H03M1/04
Abstract: Systems and methods are provided for which a chopper modulator and a chopper demodulator of a chopped apparatus having a variable chopper frequency are described. A feedback path is used to reduce ripples and/or remaining offsets as a result of the variable chopper frequency.
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公开(公告)号：US11828625B2
公开(公告)日：2023-11-28
申请号：US17713701
申请日：2022-04-05
Applicant: Infineon Technologies AG
Inventor： Mario Motz , Amirhossein Jouyaeian , Kofi Makinwa
Abstract: The described techniques address issues associated with hybrid current or magnetic field sensors used to detect both low- and high-frequency magnetic field components. The hybrid sensor implements a DC component rejection path in the high-frequency magnetic field component path. Both digital and analog implementations are provided, each functioning to generate a DC component cancellation signal to at least partially cancel a DC component of a current signal generated via the high-frequency magnetic field component path. The hybrid sensor provides a high-bandwidth, high-accuracy, and low DC offset hybrid current solution that also eliminates the need for DC decoupling capacitors in the high-frequency path. A modification is also described for implementing a Sigma-Delta (ΣΔ) quantization noise reduction path to reduce the quantization noise and to improve accuracy.
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公开(公告)号：US20230314176A1
公开(公告)日：2023-10-05
申请号：US17713701
申请日：2022-04-05
Applicant: Infineon Technologies AG
Inventor： Mario Motz , Amirhossein Jouyaeian , Kofi Makinwa
Abstract: The described techniques address issues associated with hybrid current or magnetic field sensors used to detect both low- and high-frequency magnetic field components. The hybrid sensor implements a DC component rejection path in the high-frequency magnetic field component path. Both digital and analog implementations are provided, each functioning to generate a DC component cancellation signal to at least partially cancel a DC component of a current signal generated via the high-frequency magnetic field component path. The hybrid sensor provides a high-bandwidth, high-accuracy, and low DC offset hybrid current solution that also eliminates the need for DC decoupling capacitors in the high-frequency path. A modification is also described for implementing a Sigma-Delta (ΣΔ) quantization noise reduction path to reduce the quantization noise and to improve accuracy.
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公开(公告)号：US11716060B2
公开(公告)日：2023-08-01
申请号：US17654739
申请日：2022-03-14
Applicant: Infineon Technologies AG
Inventor： Mario Motz
Abstract: The present disclosure relates to chopper amplifier circuits with inherent chopper ripple suppression. Example implementations can realize a doubly utilized chopper amplifier circuit that is a current-saving circuit with a wake-up function that is capable of providing a self-wake signal in order to change into a fast, low-jitter/low-latency mode, and to provide a wake-up signal for a sleeping microprocessor or a system in response to signal changes.
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Patent Agency Ranking
公开(公告)号：US11515887B2
公开(公告)日：2022-11-29
申请号：US17210822
申请日：2021-03-24
Applicant: Infineon Technologies AG
Inventor： Mario Motz
Abstract: A device includes a sensor configured to output an analog sensor signal, an analog-to-digital converter circuit configured to convert the analog sensor signal into a sigma-delta-modulated digital signal having a bit width of n bits, and a pulse width modulator configured to generate a pulse-width-modulated signal based on the sigma-delta-modulated digital signal.
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7.发明申请公开(公告)号：US20190013233A1
公开(公告)日：2019-01-10
申请号：US16127713
申请日：2018-09-11
Applicant: Infineon Technologies AG
Inventor： Mario Motz
CPC classification number: H01L21/71 , G01N22/00 , G01R27/02 , G01R31/2872 , G01R31/2896 , G05D15/01 , G05F1/56 , G05F3/02 , H01L23/562 , H01M8/04649
Abstract: Stress compensated systems and methods of compensating for electrical and mechanical stress are discussed. One example system can include a first circuit and a global stress compensation component. The first circuit can be configured to generate a first signal and can comprise at least one local stress compensation component (e.g., employing dynamic element matching, chopping, etc.). The global stress compensation component can comprise one or more stress sensors configured to sense one or more stress components associated with the system. The global stress compensation component can be configured to receive the first signal and to compensate for stress effects on the first signal.
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公开(公告)号：US10145882B2
公开(公告)日：2018-12-04
申请号：US15132783
申请日：2016-04-19
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Dirk Hammerschmidt , Ferdinand Gastinger , Bernhard Schaffer , Wolfgang Granig
Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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公开(公告)号：US10079600B2
公开(公告)日：2018-09-18
申请号：US15281776
申请日：2016-09-30
Applicant: Infineon Technologies AG
Inventor： Mario Motz
IPC: G01R17/02 , H03K17/95 , H03K5/24 , G01D5/14 , G01P3/489 , G01P13/00 , G01R33/00 , H03K17/94 , G01R19/00
CPC classification number: H03K17/9517 , G01D5/142 , G01P3/489 , G01P13/00 , G01R17/02 , G01R19/0092 , G01R33/0029 , H03K5/2472 , H03K17/94
Abstract: The present disclosure relates to a method and apparatus to perform a low power activation of a system. In one embodiment, the apparatus includes a sensor element configured to output a sensor output signal corresponding to a sensed quantity to a digital difference detection circuit. The digital difference detection circuit has a digital measurement element configured to track the sensor output signal and generate a digital signal therefrom, a digital storage element configured to store previous digital signals corresponding to the sensor output signal generated over time, and a difference detector configured to detect a difference between a current digital signal and at least one of the previous digital signals. If the difference is larger than a digital reference level, the difference detector causes an activation signal generator to generate an activation signal that awakens a system from a sleep mode or a low-power mode.
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公开(公告)号：US10050649B2
公开(公告)日：2018-08-14
申请号：US14924895
申请日：2015-10-28
Applicant: Infineon Technologies AG
Inventor： Christof Bodner , Mario Motz , Wolfgang Scherr
IPC: H04B1/04
Abstract: Devices and methods are provided where a first signal is provided via an interface, and a second signal is provided related to the suitability of the first signal for transmission via the interface.
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