Invention Grant
- Patent Title: Correcting component failures in ion implant semiconductor manufacturing tool
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Application No.: US17827408Application Date: 2022-05-27
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Publication No.: US11862493B2Publication Date: 2024-01-02
- Inventor: Tianqing Liao , Sima Didari , Harikrishnan Rajagopal
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/06
- IPC: H01L21/06 ; G05B23/02 ; G06F16/28 ; H01J37/317 ; H01L21/67 ; G06N20/00

Abstract:
A method includes determining, based on sensor data, that one or more components of substrate processing equipment are within a pre-failure window that is after a normal operation window. Corresponding data points in the normal operation window are substantially stable along a first health index value. The corresponding data points in the pre-failure window increase from the first health index value to a peak at a second health index value. Responsive to the determining that the one or more components are within the pre-failure window, the method further includes causing performance of a corrective action associated with the one or more components of the substrate processing equipment.
Public/Granted literature
- US20220301903A1 CORRECTING COMPONENT FAILURES IN ION IMPLANT SEMICONDUCTOR MANUFACTURING TOOL Public/Granted day:2022-09-22
Information query
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