Invention Grant
- Patent Title: Molding powder
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Application No.: US18094935Application Date: 2023-01-09
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Publication No.: US11866570B2Publication Date: 2024-01-09
- Inventor: Hirokazu Komori , Junpei Terada , Hiroyuki Sendan , Tadahiro Yabu , Yukihiro Fukagawa , Kenta Murayama , Tomohiro Shiromaru , Toshio Miyatani , Masahiro Kondou , Hiroyuki Hamada
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP 18087406 2018.04.27
- Main IPC: C08K3/36
- IPC: C08K3/36 ; B33Y70/00 ; B29C64/314 ; B29C64/153 ; B33Y70/10 ; B29K27/18

Abstract:
A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 μm or more and 200 μm or less and a D10 of 12 μm or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.
Public/Granted literature
- US20230167269A1 MOLDING POWDER Public/Granted day:2023-06-01
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