Invention Grant
- Patent Title: Multilayer capacitor and board having the same mounted thereon
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Application No.: US17552786Application Date: 2021-12-16
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Publication No.: US11869718B2Publication Date: 2024-01-09
- Inventor: Gi Sub Lee , Ah Young Lee , Chung Hyeon Ryu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR 20200175198 2020.12.15 KR 20210171498 2021.12.03
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H01G4/01 ; H01G4/30 ; H05K1/18 ; H05K1/11

Abstract:
A multilayer capacitor includes a capacitor body having first to sixth surfaces, including a plurality of first and second dielectric layers and a plurality of internal electrodes stacked; and first and second external electrodes. The internal electrode includes first and second internal electrodes, a first floating electrode disposed between the first and second internal electrodes on the first dielectric layer, and second and third floating electrodes disposed on the second dielectric layer. The second floating electrode overlaps a portion of the first internal electrode and a portion of the first floating electrode, and the third floating electrode overlaps a portion of the second internal electrode and a portion of the first floating electrode. a/L is 0.113 or more, in which L is a length of the capacitor body, and a is a distance between the first floating electrode and the first or second internal electrodes.
Public/Granted literature
- US20220189690A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2022-06-16
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