公开(公告)号：US20220189690A1

公开(公告)日：2022-06-16

申请号：US17552786

申请日：2021-12-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gi Sub Lee ,  Ah Young Lee ,  Chung Hyeon Ryu

IPC: H01G4/01 ,  H01G4/30 ,  H01G4/248 ,  H05K1/18 ,  H05K1/11

Abstract: A multilayer capacitor includes a capacitor body having first to sixth surfaces, including a plurality of first and second dielectric layers and a plurality of internal electrodes stacked; and first and second external electrodes. The internal electrode includes first and second internal electrodes, a first floating electrode disposed between the first and second internal electrodes on the first dielectric layer, and second and third floating electrodes disposed on the second dielectric layer. The second floating electrode overlaps a portion of the first internal electrode and a portion of the first floating electrode, and the third floating electrode overlaps a portion of the second internal electrode and a portion of the first floating electrode. a/L is 0.113 or more, in which L is a length of the capacitor body, and a is a distance between the first floating electrode and the first or second internal electrodes.

公开(公告)号：US20220148804A1

公开(公告)日：2022-05-12

申请号：US17403161

申请日：2021-08-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chung Hyeon Ryu ,  Gi Sub Lee ,  Ah Young Lee

IPC: H01G4/012 ,  H01G4/008 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately stacked with one of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the body and connected to the internal electrodes. One of the internal electrodes includes a plurality of conductive particles and conductive nanowires each of which having a shape different from a shape of the plurality of conductive particles and being connected to at least one of the plurality of conductive particles.

公开(公告)号：US11869718B2

公开(公告)日：2024-01-09

申请号：US17552786

申请日：2021-12-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gi Sub Lee ,  Ah Young Lee ,  Chung Hyeon Ryu

IPC: H01G4/248 ,  H01G4/01 ,  H01G4/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01G4/01 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015

Abstract: A multilayer capacitor includes a capacitor body having first to sixth surfaces, including a plurality of first and second dielectric layers and a plurality of internal electrodes stacked; and first and second external electrodes. The internal electrode includes first and second internal electrodes, a first floating electrode disposed between the first and second internal electrodes on the first dielectric layer, and second and third floating electrodes disposed on the second dielectric layer. The second floating electrode overlaps a portion of the first internal electrode and a portion of the first floating electrode, and the third floating electrode overlaps a portion of the second internal electrode and a portion of the first floating electrode. a/L is 0.113 or more, in which L is a length of the capacitor body, and a is a distance between the first floating electrode and the first or second internal electrodes.

公开(公告)号：US11670452B2

公开(公告)日：2023-06-06

申请号：US17403161

申请日：2021-08-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chung Hyeon Ryu ,  Gi Sub Lee ,  Ah Young Lee

IPC: H01G4/012 ,  H01G4/008 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248

CPC classification number: H01G4/012 ,  H01G4/0085 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately stacked with one of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the body and connected to the internal electrodes. One of the internal electrodes includes a plurality of conductive particles and conductive nanowires each of which having a shape different from a shape of the plurality of conductive particles and being connected to at least one of the plurality of conductive particles.

公开(公告)号：US09142499B2

公开(公告)日：2015-09-22

申请号：US14302045

申请日：2014-06-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Taek Lee ,  Hueng Jae Oh ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

IPC: H01L23/12 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract translation: 用于封装衬底的引脚包括：连接销插入形成在外部衬底中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。