Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17516192Application Date: 2021-11-01
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Publication No.: US11869938B2Publication Date: 2024-01-09
- Inventor: Hae Geon Jung , Dong Kwon Kim , Cheol Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20210054234 2021.04.27
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/423 ; H01L29/08

Abstract:
A semiconductor device includes a substrate, a first active pattern that includes a first side wall and a second side wall opposite to the first side wall in a second horizontal direction, a first insulating structure in a first trench extending in the first horizontal direction on the first side wall of the first active pattern, a second insulating structure in a second trench extending in the first horizontal direction on the second side of the first active pattern, and includes a first insulating layer on side walls and a bottom surface of the second trench, and a second insulating layer in the second trench on the first insulating layer, a gate-cut extending in the first horizontal direction on the first insulating structure, and a gate electrode extending in the second horizontal direction on the first active pattern.
Public/Granted literature
- US20220344461A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-10-27
Information query
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