Invention Grant
- Patent Title: Compound semiconductor device
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Application No.: US17398909Application Date: 2021-08-10
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Publication No.: US11869957B2Publication Date: 2024-01-09
- Inventor: Kenji Sasaki , Kingo Kurotani , Takashi Kitahara , Shigeki Koya
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 14240327 2014.11.27
- Main IPC: H01L29/737
- IPC: H01L29/737 ; H01L23/00 ; H01L23/482 ; H01L29/417 ; H01L29/06 ; H01L23/535 ; H01L27/082 ; H01L29/40 ; H03F3/19

Abstract:
A compound semiconductor device comprises a heterojunction bipolar transistor including a plurality of unit transistors, a capacitor electrically connected between a RF input wire and a base wire for each unit transistor of the unit transistors, and a bump electrically connected to emitters of the unit transistors. The unit transistors are arranged in a first direction. The bump is disposed above the emitters of the unit transistors while extending in the first direction. The transistors include first and second unit transistors, the respective emitters of the first and second unit transistors being disposed on first and second sides, respectively, of a second direction, perpendicular to the first direction, with respect to a center line of the bump extending in the first direction. The capacitor is not covered by the bump, and respective lengths of the respective base wires connected respectively to the first and second unit transistors are different.
Public/Granted literature
- US20210367066A1 COMPOUND SEMICONDUCTOR DEVICE Public/Granted day:2021-11-25
Information query
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