Invention Grant
- Patent Title: Diffusion bonded lead connector
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Application No.: US17536360Application Date: 2021-11-29
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Publication No.: US11872392B2Publication Date: 2024-01-16
- Inventor: Darren A. Janzig , Andrew J. Thom , Chris J. Paidosh , Brad C. Tischendorf , Gerald G. Lindner
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Mueting Raasch Group
- Main IPC: A61N1/05
- IPC: A61N1/05 ; H01R13/187 ; H01R24/58 ; A61N1/375 ; B23K26/21 ; B23K20/02 ; C23C14/10 ; C23C14/18 ; C23C14/34 ; H01R43/02 ; B23K101/38 ; B23K103/00 ; B23K103/16 ; H01R107/00
Abstract:
A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
Public/Granted literature
- US20220080188A1 DIFFUSION BONDED LEAD CONNECTOR Public/Granted day:2022-03-17
Information query
