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    CERAMIC ENCLOSURE FOR RECHARGEABLE MEDICAL DEVICES
    1.
    发明公开
    CERAMIC ENCLOSURE FOR RECHARGEABLE MEDICAL DEVICES 审中-公开

    公开(公告)号：US20230158313A1

    公开(公告)日：2023-05-25

    申请号：US18050361

    申请日：2022-10-27

    Applicant: Medtronic, Inc.

    Inventor： Paul B. Young ,  Rajesh V. Iyer ,  Andrew J. Thom

    IPC: A61N1/375 ,  A61N1/378 ,  H02J50/10

    CPC classification number: A61N1/375 ,  A61N1/3787 ,  H02J50/10

    Abstract: In some examples a medical device includes circuitry configured to at least one of sense a physiological parameter of a patient or deliver a therapy to the patient. The medical device may also include a housing configured to house the circuitry, wherein the housing includes a plurality of structural members and an attachment mechanism that joins the plurality of structural members. The attachment mechanism may be configured to suppress induced currents in the housing when the medical device is exposed to a time-varying magnetic field.

    MEDICAL DEVICES HAVING DEFORMABLE STRUCTURES PROVIDING MEDICAL LEAD FIXATION
    4.
    发明申请
    MEDICAL DEVICES HAVING DEFORMABLE STRUCTURES PROVIDING MEDICAL LEAD FIXATION 审中-公开
    具有提供医疗铅固定的可变结构的医疗装置

    公开(公告)号：US20160129267A1

    公开(公告)日：2016-05-12

    申请号：US14939613

    申请日：2015-11-12

    Applicant: MEDTRONIC, INC.

    Inventor： Andrew J. Thom ,  Rajesh V. Iyer ,  Darren A. Janzig ,  Randy S. Roles

    IPC: A61N1/375

    CPC classification number: A61N1/3752 ,  A61N1/3605

    Abstract: Medical devices include deformable structures that contact a lead upon being compressed. A grip that a clinician may grasp and manipulate is engaged with a nose structure of a header block of the medical device, and manipulation of the grip causes compression of the deformable structure to ultimately create fixation of the lead within the header block.

    Abstract translation: 医疗装置包括在压缩时接触引线的可变形结构。 临床医生可以抓握和操作的手柄与医疗装置的头部块的鼻部结构接合，并且手柄的操纵引起可变形结构的压缩，以最终形成引线在头部块内的固定。

    IMPLANTABLE DEVICE WITH CHASSIS ELEMENT
    5.
    发明申请
    IMPLANTABLE DEVICE WITH CHASSIS ELEMENT 有权
    具有基座元件的可植入装置

    公开(公告)号：US20150094789A1

    公开(公告)日：2015-04-02

    申请号：US14394507

    申请日：2013-03-12

    Applicant: MEDTRONIC, INC.

    Inventor： Darren A. Janzig ,  Gerald Lindner ,  Chris J. Paidosh ,  Andrew J. Thom ,  Brad C. Tischendorf

    IPC: A61N1/375

    CPC classification number: A61N1/3758 ,  A61N1/375 ,  A61N1/3752

    Abstract: A implantable active medical device includes a chassis plate having a first major surface and an opposing second major surface, an elongate lead connector fixed to the first major surface and extending orthogonally away from the first major surface and a circuit board fixed to the first major surface and extending orthogonally away from the first major surface. A hermetic housing defines a sealed housing cavity. The hermetic housing is fixed to the first major surface. The elongate lead connector and the circuit board are disposed within the sealed housing cavity.

    Abstract translation: 可植入有源医疗装置包括具有第一主表面和相对的第二主表面的底板，固定到第一主表面并且垂直于第一主表面延伸的细长引线连接器和固定到第一主表面的电路板 并垂直于第一主表面延伸。 密封壳体限定密封的壳体腔。 密封壳体固定在第一主表面上。 细长引线连接器和电路板设置在密封的壳体腔内。

    SEALED PACKAGE AND METHOD OF FORMING SAME
    6.
    发明申请
    SEALED PACKAGE AND METHOD OF FORMING SAME 有权

    公开(公告)号：US20210120692A1

    公开(公告)日：2021-04-22

    申请号：US17136242

    申请日：2020-12-29

    Applicant: Medtronic, Inc.

    Inventor： Christian S. Nielsen ,  Rajesh V. Iyer ,  Gordon O. Munns ,  Andrew J. Ries ,  Andrew J. Thom

    IPC: H05K5/06 ,  A61N1/378 ,  A61N1/375 ,  H05K5/00 ,  H05K7/14 ,  H01M50/543

    Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

    MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREFOR
    9.
    发明申请
    MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREFOR 有权
    多电极可植入系统及其组合

    公开(公告)号：US20130325086A1

    公开(公告)日：2013-12-05

    申请号：US13962987

    申请日：2013-08-09

    Applicant: Medtronic, Inc.

    Inventor： John Louis Sommer ,  Joseph Michael D'Sa ,  Joyce K. Yamamoto ,  Brad C. Tischendorf ,  James D. Reinke ,  Andrew J. Thom ,  Thomas P. Miltich ,  William John Taylor ,  Kenneth C. Gardeski ,  Larry Earl Tyler ,  Jeffrey O. York ,  Gordon O. Munns

    IPC: A61N1/05 ,  A61N1/372

    CPC classification number: A61N1/362 ,  A61N1/05 ,  A61N1/056 ,  A61N1/372

    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

    Abstract translation: 例如，包括IC芯片的密封组件被配置为并入可植入医疗电线的连接器端子内，优选地在端子的接触构件内。 组件可以包括焊接到接触构件的任一端的两个馈通子组件，以形成封闭IC芯片的密封胶囊，以及允许内腔沿着端子的长度延伸穿过的管状构件 。 多电极引线可以包括多路复用器电路，优选地是开关矩阵元件和通信，控制和电源元件，其电耦合到接触构件和终端的另一接触构件。 每对开关矩阵开关允许选择任何两个电极，以便通过来自连接器端子连接到的装置/脉冲发生器的刺激脉冲传送刺激矢量。

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