A method of controlling application of at least one material onto a substrate includes configuring a material applicator having an array plate with an applicator array. The applicator array has a plurality of micro-applicators with a first subset of micro-applicators and a second subset of micro-applicators. Each of the plurality of micro-applicators has a plurality of apertures through which fluid is ejected. The first subset of micro-applicators and the second subset of micro-applicators are individually addressable, and a liquid flows through the first subset of micro-applicators and a shaping gas, e.g., air, flows through the second subset of micro-applicators. The flow of shaping gas shapes the flow of the liquid from the first subset of micro-applicators to the substrate.