Invention Grant
- Patent Title: Supplying material to an additive manufacturing platform
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Application No.: US16607778Application Date: 2018-07-12
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Publication No.: US11872763B2Publication Date: 2024-01-16
- Inventor: Pau Martin Vidal , Fernando Juan Jover , Gerard Mosquera Donate
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: SHOOK, HARDY & BACON L.L.P.
- International Application: PCT/US2018/041868 2018.07.12
- International Announcement: WO2020/013828A 2020.01.16
- Date entered country: 2019-10-24
- Main IPC: B29C64/321
- IPC: B29C64/321 ; B29C64/40 ; B33Y30/00 ; B33Y40/00 ; B33Y10/00

Abstract:
In one example, an apparatus for supplying material to an additive manufacturing platform comprises a rotatable delivery module comprising a vane; and a plurality of distribution elements. In use, the rotatable delivery module is controllable to rotate the vane to a supply position to enable material to be supplied to an additive manufacturing platform from the vane. The vane and the plurality of distribution elements are arranged such that during the rotation: the vane provides a dose amount of material from a material supply module for supply to an additive manufacturing platform and at least one of the plurality of distribution elements distributes material within the material supply module so that the vane supplies a substantially uniform dose of material along the length of the vane to the additive manufacturing platform.
Public/Granted literature
- US20210354385A1 SUPPLYING MATERIAL TO AN ADDITIVE MANUFACTURING PLATFORM Public/Granted day:2021-11-18
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