Invention Grant
- Patent Title: Semiconductor package
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Application No.: US17407647Application Date: 2021-08-20
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Publication No.: US11876083B2Publication Date: 2024-01-16
- Inventor: Dongho Kim , Ji Hwang Kim , Hwan Pil Park , Jongbo Shim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200164363 2020.11.30
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L25/10 ; H01L25/065 ; H01L21/48

Abstract:
Provided is a semiconductor package comprising a lower package that includes a lower substrate and a lower semiconductor chip, an interposer substrate on the lower package and having a plurality of holes that penetrate the interposer substrate, a thermal radiation structure that includes a supporter on a top surface of the interposer substrate and a plurality of protrusions in the holes of the interposer substrate, and a thermal conductive layer between the lower semiconductor chip and the protrusions of the thermal radiation structure.
Public/Granted literature
- US20220173082A1 SEMICONDUCTOR PACKAGE Public/Granted day:2022-06-02
Information query
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