A sensor device includes an electrically conductive body adapted to accommodate a first printed circuit board (PCB) and a second PCB, a flexible electrically conductive device connecting the first PCB and the second PCB, and an electrically conductive spring held between the first PCB and the second PCB by a snap-fit, a form-fit or a press-fit connection. A first portion of the electrically conductive spring is pressed against one of the first PCB and the second PCB and a second portion of the electrically conductive spring is pressed against the electrically conductive body to maintain an electrical connection between the electrically conductive body, the first PCB, and the second PCB.