Invention Grant
- Patent Title: Coil component
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Application No.: US16402520Application Date: 2019-05-03
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Publication No.: US11881345B2Publication Date: 2024-01-23
- Inventor: Gun Woo Koo , Sung Min Song , Hwan Soo Lee , Hwi Dae Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190023544 2019.02.28
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/28 ; H01F41/12 ; H01F41/04 ; H01F27/32

Abstract:
A coil component includes a body, an internal insulating layer disposed in the body, and a coil portion disposed on the internal insulating layer. The coil portion includes first and second coil patterns disposed on opposing surfaces of the internal insulating layer, respectively, first main and first auxiliary lead-out portions extending from the first coil pattern and respectively exposed to a front surface and one side surface of the body connected to each other, and second main and second auxiliary lead-out portions extending from the second coil pattern and respectively exposed to a rear surface and another side surface of the body connected to each other.
Public/Granted literature
- US20200279687A1 COIL COMPONENT Public/Granted day:2020-09-03
Information query