Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16530407Application Date: 2019-08-02
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Publication No.: US11881346B2Publication Date: 2024-01-23
- Inventor: In Young Kang , Byeong Cheol Moon , Doo Ho Park , Tai Yon Cho , No Il Park , Seung Mo Lim , Tae Jun Choi , Jeong Hoon Ryou
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190051942 2019.05.03
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/28

Abstract:
A coil electronic component includes a body having one surface and the other surface, opposing each other, and a plurality of wall surfaces respectively connecting the one surface and the other surface of the body, first and second recesses, respectively formed in both end surfaces of the body opposing each other among the plurality of wall surfaces of the body, extending to the one surface of the body, a wound coil, embedded in the body, including first and second lead-out portions, a first external electrode disposed along an internal wall of the first recess and the one surface of the body and connected to the first lead-out portion, and a second external electrode disposed along an internal wall of the second recess and the one surface of the body and connected to the first lead-out portion. The first and second external electrodes are spaced apart from each other.
Public/Granted literature
- US20200350115A1 COIL ELECTRONIC COMPONENT Public/Granted day:2020-11-05
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