Invention Grant
- Patent Title: Tri-layer STI liner for nanosheet leakage control
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Application No.: US17198214Application Date: 2021-03-10
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Publication No.: US11881505B2Publication Date: 2024-01-23
- Inventor: Choonghyun Lee , Xin Miao , Alexander Reznicek , Jingyun Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Michael A. Petrocelli
- The original application number of the division: US16408799 2019.05.10
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/8238 ; H01L21/02 ; H01L21/762 ; H01L21/768 ; H01L29/161 ; H01L29/78 ; H01L29/66 ; H01L27/092

Abstract:
A semiconductor structure includes a plurality of fins on a semiconductor substrate, the plurality of fins including an alternating sequence of a first nanosheet made of epitaxially grown silicon and a second nanosheet made of epitaxially grown silicon germanium, and a shallow trench isolation region within the semiconductor substrate adjacent to the plurality of fins. The shallow trench isolation region including a recess within the substrate filled with a first liner, a second liner directly above the first liner, a third liner directly above the second liner, and a dielectric material directly above the third liner. The first liner is made of a first oxide material, the third liner is made of a nitride material, and the second liner is made of a second oxide material that creates a dipole effect for neutralizing positive charges within the third liner and positive charges between the third liner and the first liner.
Public/Granted literature
- US20210202325A1 TRI-LAYER STI LINER FOR NANOSHEET LEAKAGE CONTROL Public/Granted day:2021-07-01
Information query
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