Invention Grant
- Patent Title: Power amplifier module
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Application No.: US18057400Application Date: 2022-11-21
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Publication No.: US11881822B2Publication Date: 2024-01-23
- Inventor: Hiroshi Okabe
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 17075550 2017.04.05
- Main IPC: H03F3/14
- IPC: H03F3/14 ; H03F3/68 ; H03F3/213 ; H03F3/72 ; H03F3/195 ; H03F1/56 ; H03F3/24 ; H03F3/191 ; H03F3/19

Abstract:
A power amplifier module includes an output-stage amplifier, a driver-stage amplifier, an input switch, an output switch, an input matching circuit, an inter-stage matching circuit, an output matching circuit, and a control circuit. The input switch selectively connects one of a plurality of input signal paths to an input terminal of the driver-stage amplifier. The output switch selectively connects one of a plurality of output signal paths to an output terminal of the output-stage amplifier. The control circuit controls operations of the driver-stage amplifier and the output-stage amplifier. The input switch, the output switch, and the control circuit are integrated into an IC chip. The control circuit is disposed between the input switch and the output switch.
Public/Granted literature
- US20230100525A1 POWER AMPLIFIER MODULE Public/Granted day:2023-03-30
Information query
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