Invention Grant
- Patent Title: Surface mount pads for next generation speeds
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Application No.: US16888644Application Date: 2020-05-29
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Publication No.: US11882655B2Publication Date: 2024-01-23
- Inventor: Umesh Chandra , Douglas Wallace , Bhyrav Mutnury
- Applicant: DELL PRODUCTS L.P.
- Applicant Address: US TX Round Rock
- Assignee: DELL PRODUCTS L.P.
- Current Assignee: DELL PRODUCTS L.P.
- Current Assignee Address: US TX Round Rock
- Agency: NORTH WEBER & BAUGH LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11

Abstract:
A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.
Public/Granted literature
- US20210378094A1 SURFACE MOUNT PADS FOR NEXT GENERATION SPEEDS Public/Granted day:2021-12-02
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