Invention Grant
- Patent Title: Resistive random access memory and manufacturing method thereof
-
Application No.: US17396493Application Date: 2021-08-06
-
Publication No.: US11882773B2Publication Date: 2024-01-23
- Inventor: Kai Jiun Chang , Chun-Hung Cheng , Chuan-Fu Wang
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. PATENTS
- Priority: TW 0126609 2021.07.20
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H10N70/20

Abstract:
Provided are a resistive random access memory (RRAM) and a manufacturing method thereof. The resistive random access memory includes multiple unit structures disposed on a substrate. Each of the unit structures includes a first electrode, a first metal oxide layer, and a spacer. The first electrode is disposed on the substrate. The first metal oxide layer is disposed on the first electrode. The spacer is disposed on sidewalls of the first electrode and the first metal oxide layer. In addition, the resistive random access memory includes a second metal oxide layer and a second electrode. The second metal oxide layer is disposed on the unit structures and is connected to the unit structures. The second electrode is disposed on the second metal oxide layer.
Public/Granted literature
- US20230027508A1 RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-01-26
Information query