Invention Grant
- Patent Title: Display panel motherboard, cutting method and manufacturing method thereof, display panel, and display device
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Application No.: US16977300Application Date: 2019-11-29
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Publication No.: US11886063B2Publication Date: 2024-01-30
- Inventor: Shulei Li , Hua Huang , Zhao Kang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Scully, Scott, Murphy & Presser, P.C.
- International Application: PCT/CN2019/122012 2019.11.29
- International Announcement: WO2021/102921A 2021.06.03
- Date entered country: 2020-09-01
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; G02F1/1335

Abstract:
A display panel motherboard, a cutting method and a manufacturing method thereof, a display panel, and a display device are provided. The display panel motherboard includes at least three mother substrates, at least one display panel unit, and a cutting region. The at least three mother substrates are stacked with each other, at least a portion of the at least one display panel unit is surrounded by the cutting region, and an organic film layer is not disposed in at least two of the at least three mother substrates in the cutting region.
Public/Granted literature
Information query
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