- 专利标题： Electronic power module
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申请号： US17272843申请日： 2019-09-02
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公开(公告)号： US11887910B2公开(公告)日： 2024-01-30
- 发明人: Kremena Vladimirova , Jean-Christophe Crebier , Julie Widiez
- 申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
- 申请人地址： FR Paris
- 专利权人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES,CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
- 当前专利权人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES,CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
- 当前专利权人地址： FR Paris; FR Paris
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： FR 57934 2018.09.04
- 国际申请： PCT/FR2019/052014 2019.09.02
- 国际公布： WO2020/049245A 2020.03.12
- 进入国家日期： 2021-03-02
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/373 ; H01L23/492
摘要：
An electronic power module includes at least a semiconductor chip having at least one electronic power component and two metal layers between which the semiconductor chip is directly secured. At least a first of the two metal layers forms a redistribution layer having several distinct metal portions, each electrically connected to at least one electrical contact pad of the semiconductor chip, and/or at least one second of the two metal layers includes at least one first structured face arranged against the semiconductor chip and having at least one pad formed in a part of its thickness.
公开/授权文献
- US20210351100A1 ELECTRONIC POWER MODULE 公开/授权日：2021-11-11
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