Invention Grant
- Patent Title: Integrated circuit having contact jumper
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Application No.: US18119560Application Date: 2023-03-09
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Publication No.: US11887914B2Publication Date: 2024-01-30
- Inventor: Jung-Ho Do , Tae-Joong Song , Seung-Young Lee , Jong-Hoon Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR 20170017676 2017.02.08 KR 20170081831 2017.06.28
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/482 ; H01L27/02 ; H01L27/118 ; H01L23/485 ; H01L21/768 ; G06F30/394 ; G06F30/392

Abstract:
An integrated circuit includes first and second active regions extending in a first direction, a first gate line extending in a second direction substantially perpendicular to the first direction and crossing the first and second active regions, and a first contact jumper including a first conductive pattern intersecting the first gate line above the first active region and a second conductive pattern extending in the second direction above the first gate line and connected to the first conductive pattern.
Public/Granted literature
- US20230207429A1 INTEGRATED CIRCUIT HAVING CONTACT JUMPER Public/Granted day:2023-06-29
Information query
IPC分类: