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公开(公告)号:US10811357B2
公开(公告)日:2020-10-20
申请号:US15946075
申请日:2018-04-05
发明人: Jae-Boong Lee , Jung-Ho Do , Tae-Joong Song , Seung-Young Lee , Jong-Hoon Jung , Ji-Su Yu
IPC分类号: H01L23/528 , H01L27/02 , H01L23/522 , H01L21/8234 , H01L27/118 , G06F30/327 , G06F30/394 , H01L27/088 , H01L27/092 , G06F30/392
摘要: An integrated circuit including: a power rail including first and second conductive lines spaced apart from each other in a vertical direction, wherein the first and second conductive lines extend in parallel to each other in a first horizontal direction, and are electrically connected to each other, to supply power to a first standard cell, wherein the first and second conductive lines are disposed at a boundary of the first standard cell; and a third conductive line between the first and second conductive lines and extending in a second horizontal direction orthogonal to the first horizontal direction, to transfer an input signal or an output signal of the first standard cell.
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公开(公告)号:US10445455B2
公开(公告)日:2019-10-15
申请号:US15689008
申请日:2017-08-29
发明人: Jung-Ho Do , Jong-Hoon Jung , Seung-Young Lee , Tae-Joong Song
摘要: An integrated circuit includes: a lower layer including first and second lower patterns extending in a first direction; a first via arranged on the first lower pattern, and a second via arranged on the second lower pattern; a first upper pattern arranged on the first via; and a second upper pattern arranged on the second via, a first color is assigned to the first upper pattern, a second color is assigned to the second upper pattern, the first and second upper patterns are adjacent to each other in a second direction, and the first via is arranged in a first edge region of the first lower pattern, the first edge region being farther away from the second lower pattern than a second edge region of the first lower pattern, the second edge region being opposite to the first edge region.
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公开(公告)号:US09825024B2
公开(公告)日:2017-11-21
申请号:US14870141
申请日:2015-09-30
发明人: Jong-Hoon Jung
IPC分类号: H01L27/02 , H01L27/11 , H01L29/78 , H01L23/528 , H01L27/108
CPC分类号: H01L27/0292 , H01L23/528 , H01L23/5286 , H01L27/10897 , H01L27/1116 , H01L28/00 , H01L29/78
摘要: A semiconductor device is provided. The semiconductor device includes an active region, a gate line, a first metal interconnect, a power rail, and a second metal interconnect. The gate line overlaps the active region and extends along a first direction. The first metal interconnect overlaps the active region and the gate line. The first metal interconnect extends along a second direction intersecting the first direction. The power rail is disposed in a higher layer than the first metal interconnect. The power rail extends along the second direction. The second metal interconnect is disposed in a same layer as the power rail, the second metal interconnect extends along the second direction.
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公开(公告)号:US20170098641A1
公开(公告)日:2017-04-06
申请号:US14874989
申请日:2015-10-05
发明人: Jong-Hoon Jung
IPC分类号: H01L27/02 , H01L29/06 , H01L27/088 , H01L23/528 , H01L23/522
CPC分类号: H01L27/0207 , H01L21/823437 , H01L21/823475 , H01L23/5221 , H01L23/5226 , H01L23/528 , H01L27/088 , H01L27/0886 , H01L29/0649 , H01L29/78
摘要: According to an exemplary embodiment of the present inventive concept, a semiconductor device is provided as follows. An active region is disposed in one side of a gate line. A non-active region is disposed in the other side of the gate line. A jumper pattern crosses a top portion of the gate line, overlapping the active region and the non-active region. A boundary between the active region and the non-active region is underneath the gate line.
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公开(公告)号:US12125787B2
公开(公告)日:2024-10-22
申请号:US17037569
申请日:2020-09-29
发明人: Jae-Boong Lee , Jung-Ho Do , Tae-Joong Song , Seung-Young Lee , Jong-Hoon Jung , Ji-Su Yu
IPC分类号: H01L23/528 , G06F30/327 , G06F30/392 , G06F30/394 , H01L21/8234 , H01L23/522 , H01L27/02 , H01L27/088 , H01L27/092 , H01L27/118 , G06F115/02
CPC分类号: H01L23/5286 , G06F30/327 , G06F30/392 , G06F30/394 , H01L21/823475 , H01L23/5226 , H01L23/5283 , H01L27/0207 , H01L27/11807 , G06F2115/02 , H01L27/088 , H01L27/092 , H01L2027/11881
摘要: An integrated circuit including: a power rail including first and second conductive lines spaced apart from each other in a vertical direction, wherein the first and second conductive lines extend in parallel to each other in a first horizontal direction, and are electrically connected to each other, to supply power to a first standard cell, wherein the first and second conductive lines are disposed at a boundary of the first standard cell; and a third conductive line between the first and second conductive lines and extending in a second horizontal direction orthogonal to the first horizontal direction, to transfer an input signal or an output signal of the first standard cell.
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公开(公告)号:US11335673B2
公开(公告)日:2022-05-17
申请号:US16191720
申请日:2018-11-15
发明人: Jung-Ho Do , Dal-Hee Lee , Jin-Young Lim , Tae-Joong Song , Jong-Hoon Jung
IPC分类号: H01L27/02 , H01L27/118 , G11C5/06 , G06F30/00 , G11C8/16 , G11C11/412 , H01L21/768 , H01L27/088
摘要: An integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. A first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. The first transistor may include a gate to which a first input signal is applied. The first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.
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公开(公告)号:US20200034508A1
公开(公告)日:2020-01-30
申请号:US16589360
申请日:2019-10-01
发明人: Jung-Ho Do , Jong-Hoon Jung , Seung-Young Lee , Tae-Joong Song
摘要: An integrated circuit includes: a lower layer including first and second lower patterns extending in a first direction; a first via arranged on the first lower pattern, and a second via arranged on the second lower pattern; a first upper pattern arranged on the first via; and a second upper pattern arranged on the second via, a first color is assigned to the first upper pattern, a second color is assigned to the second upper pattern, the first and second upper patterns are adjacent to each other in a second direction, and the first via is arranged in a first edge region of the first lower pattern, the first edge region being farther away from the second lower pattern than a second edge region of the first lower pattern, the second edge region being opposite to the first edge region.
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公开(公告)号:US20190355750A1
公开(公告)日:2019-11-21
申请号:US16409129
申请日:2019-05-10
发明人: Jung-ho Do , Ji-Su Yu , Hyeon-gyu You , Seung-Young Lee , Jae-Boong Lee , Jong-Hoon Jung
IPC分类号: H01L27/118 , H01L27/02
摘要: An integrated circuit includes a standard cell. The standard cell may include a plurality of gate lines and a plurality of first wirings. The plurality of first wirings may include a clubfoot structure conductive pattern that includes a first conductive pattern and a second conductive pattern spaced apart from each other. Each of the first conductive pattern and the second conductive pattern may include a first line pattern extending in a first direction and a second line pattern protruding from one end of the first line pattern in a direction perpendicular to the first direction. The plurality of gate lines may be spaced apart from each other by a first pitch in the first direction, and the plurality of second wirings may be spaced apart from each other by a second pitch in the first direction. The first pitch may be greater than the second pitch.
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公开(公告)号:US20180294226A1
公开(公告)日:2018-10-11
申请号:US15946075
申请日:2018-04-05
发明人: Jae-Boong Lee , Jung-Ho Do , Tae-Joong Song , Seung-Young Lee , Jong-Hoon Jung , Ji-Su Yu
IPC分类号: H01L23/528 , H01L27/02 , H01L23/522 , H01L21/8234
摘要: An integrated circuit including: a power rail including first and second conductive lines spaced apart from each other in a vertical direction, wherein the first and second conductive lines extend in parallel to each other in a first horizontal direction, and are electrically connected to each other, to supply power to a first standard cell, wherein the first and second conductive lines are disposed at a boundary of the first standard cell; and a third conductive line between the first and second conductive lines and extending in a second horizontal direction orthogonal to the first horizontal direction, to transfer an input signal or an output signal of the first standard cell.
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公开(公告)号:US10832988B2
公开(公告)日:2020-11-10
申请号:US16394961
申请日:2019-04-25
发明人: Jung-Ho Do , Tae-Joong Song , Seung-Young Lee , Jong-Hoon Jung
IPC分类号: H01L23/48 , H01L23/482 , H01L27/02 , H01L27/118 , H01L23/485 , H01L21/768 , G06F30/394 , G06F30/392
摘要: An integrated circuit includes first and second active regions extending in a first direction, a first gate line extending in a second direction substantially perpendicular to the first direction and crossing the first and second active regions, and a first contact jumper including a first conductive pattern intersecting the first gate line above the first active region and a second conductive pattern extending in the second direction above the first gate line and connected to the first conductive pattern.
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