Invention Grant
- Patent Title: Semiconductor package with stepped redistribution structure exposing mold layer
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Application No.: US17213506Application Date: 2021-03-26
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Publication No.: US11887931B2Publication Date: 2024-01-30
- Inventor: Inhyung Song , Kyoung Lim Suk , Jaegwon Jang , Wonkyoung Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20200107781 2020.08.26
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/522 ; H01L23/00 ; H01L23/31 ; H01L23/495 ; H01L23/528 ; H01L23/532 ; H01L27/08 ; H01L23/538
Abstract:
A semiconductor package includes a first semiconductor device on a first redistribution substrate, a first mold layer that covers the first semiconductor device and the first redistribution substrate, and a second redistribution substrate on the first mold layer, the second redistribution substrate including a first opening that exposes a top surface of the first mold layer, a sidewall of the second redistribution substrate that is exposed to the first opening having a stepwise structure.
Public/Granted literature
- US20220068818A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-03-03
Information query
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