Invention Grant
- Patent Title: Structures for a high-electron-mobility transistor and related methods
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Application No.: US16869851Application Date: 2020-05-08
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Publication No.: US11888051B2Publication Date: 2024-01-30
- Inventor: Jiacheng Lei , Lawrence Selvaraj Susai , Joseph James Jerry
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GlobalFoundries Singapore Pte. Ltd.
- Current Assignee: GlobalFoundries Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/423 ; H01L29/201

Abstract:
Structures for a high-electron-mobility transistor and methods of forming a structure for a high-electron-mobility transistor. The high-electron-mobility transistor has a first semiconductor layer, a second semiconductor layer adjoining the first semiconductor layer along an interface, a gate electrode, and a source/drain region. An insulator region is provided in the first semiconductor layer and the second semiconductor layer. The insulator region extends through the interface at a location laterally between the gate electrode and the source/drain region.
Public/Granted literature
- US20210351286A1 STRUCTURES FOR A HIGH-ELECTRON-MOBILITY TRANSISTOR AND RELATED METHODS Public/Granted day:2021-11-11
Information query
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