Invention Grant
- Patent Title: Ethylene-based polymers with improved melt strength and thermal stability
-
Application No.: US17254987Application Date: 2019-06-26
-
Publication No.: US11891463B2Publication Date: 2024-02-06
- Inventor: John O. Osby , Hayley A. Brown , Mehmet Demirors , Carmelo Declet Perez
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Boyle Fredrickson, S.C.
- International Application: PCT/US2019/039289 2019.06.26
- International Announcement: WO2020/006104A 2020.01.02
- Date entered country: 2020-12-22
- Main IPC: C08F210/02
- IPC: C08F210/02 ; C08F236/20 ; C08L23/08 ; C08F220/40 ; C08F2/38 ; C08F210/06
Abstract:
An ethylene-based polymer formed from reacting at least the following: ethylene and at least one asymmetrical polyene, of Structure 1, as described herein.
Public/Granted literature
- US20210261702A1 Ethylene-Based Polymers with Improved Melt Strength and Thermal Stability Public/Granted day:2021-08-26
Information query
