- Patent Title: Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set
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Application No.: US16863297Application Date: 2020-04-30
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Publication No.: US11891505B2Publication Date: 2024-02-06
- Inventor: Kazuhiro Hamada , Kazushi Furukawa , Yoshihiro Nakai
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 17212209 2017.11.01
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08K5/17 ; C08G59/50 ; G01N29/24 ; G10K11/18 ; G10K11/36 ; C08K3/08

Abstract:
Provided is a resin composition for an acoustic matching layer, the resin composition including an epoxy resin (A), a specific polyamine compound (B), and metal particles (C). The epoxy resin (A) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, a method for producing an acoustic probe, and an acoustic matching layer material set.
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