Invention Grant
- Patent Title: Semiconductor package and method of manufacturing semiconductor package
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Application No.: US18174576Application Date: 2023-02-24
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Publication No.: US11894242B2Publication Date: 2024-02-06
- Inventor: Taeyoung Kim , Seokhong Kwon , Wonyoung Kim , Jinchan Ahn
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO, LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO, LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20200077095 2020.06.24
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/56 ; H01L23/24 ; H01L23/00
Abstract:
A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.
Public/Granted literature
- US20230223279A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE Public/Granted day:2023-07-13
Information query
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