公开(公告)号：US11894242B2

公开(公告)日：2024-02-06

申请号：US18174576

申请日：2023-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyoung Kim ,  Seokhong Kwon ,  Wonyoung Kim ,  Jinchan Ahn

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/24 ,  H01L23/00

CPC classification number: H01L21/565 ,  H01L23/24 ,  H01L21/561 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.

公开(公告)号：US20230223279A1

公开(公告)日：2023-07-13

申请号：US18174576

申请日：2023-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyoung Kim ,  Seokhong Kwon ,  Wonyoung Kim ,  Jinchan Ahn

IPC: H01L21/56 ,  H01L23/24 ,  H01L23/00

CPC classification number: H01L21/565 ,  H01L23/24 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2224/73204 ,  H01L24/16 ,  H01L21/561 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/73265

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.

公开(公告)号：US11887907B2

公开(公告)日：2024-01-30

申请号：US17850221

申请日：2022-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonyoung Kim

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/3185 ,  H01L21/561 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/97 ,  H01L2224/02331 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/14134 ,  H01L2224/16225

Abstract: A semiconductor package includes a semiconductor chip having chip pads on a first surface and having first and second side surfaces opposite to each other and third and fourth side surfaces opposite to each other, a molding member covering the third and fourth side surfaces and exposing the first and second side surfaces of the semiconductor chip, a redistribution wiring layer on a lower surface of the molding member to cover the first surface of the semiconductor chip and including a plurality of redistribution wirings electrically connected to the chip pads, and outer connection members arranged in a connection region defined on an outer surface of the redistribution wiring layer and electrically connected to the redistribution wirings.

公开(公告)号：US11869878B2

公开(公告)日：2024-01-09

申请号：US17453725

申请日：2021-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungseon Hwang ,  Wonyoung Kim ,  Jinchan Ahn

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/3142 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/45 ,  H01L24/73

Abstract: A semiconductor module includes a module substrate, a semiconductor package mounted on the module substrate, a first bonding wire connecting the module substrate to the semiconductor package, and a first molding member covering the first bonding wire. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, a second bonding wire connecting the package substrate to the semiconductor chip, and a second molding member covering the semiconductor chip and the second bonding wire. The first and second bonding wires are each connected to one connection pad of the package substrate.

公开(公告)号：US20210407821A1

公开(公告)日：2021-12-30

申请号：US17212364

申请日：2021-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： TAEYOUNG KIM ,  Seokhong Kwon ,  Wonyoung Kim ,  Jinchan Ahn

IPC: H01L21/56 ,  H01L23/24

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.

公开(公告)号：US20210249323A1

公开(公告)日：2021-08-12

申请号：US17004559

申请日：2020-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonyoung Kim

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor chip having chip pads on a first surface and having first and second side surfaces opposite to each other and third and fourth side surfaces opposite to each other, a molding member covering the third and fourth side surfaces and exposing the first and second side surfaces of the semiconductor chip, a redistribution wiring layer on a lower surface of the molding member to cover the first surface of the semiconductor chip and including a plurality of redistribution wirings electrically connected to the chip pads, and outer connection members arranged in a connection region defined on an outer surface of the redistribution wiring layer and electrically connected to the redistribution wirings.

公开(公告)号：US11610786B2

公开(公告)日：2023-03-21

申请号：US17212364

申请日：2021-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyoung Kim ,  Seokhong Kwon ,  Wonyoung Kim ,  Jinchan Ahn

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/24 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.

公开(公告)号：US11171119B2

公开(公告)日：2021-11-09

申请号：US16695971

申请日：2019-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungseon Hwang ,  Wonyoung Kim ,  Jinchan Ahn

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor module includes a module substrate, a semiconductor package mounted on the module substrate, a first bonding wire connecting the module substrate to the semiconductor package, and a first molding member covering the first bonding wire. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, a second bonding wire connecting the package substrate to the semiconductor chip, and a second molding member covering the semiconductor chip and the second bonding wire. The first and second bonding wires are each connected to one connection pad of the package substrate.

公开(公告)号：US11373919B2

公开(公告)日：2022-06-28

申请号：US17004559

申请日：2020-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonyoung Kim

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor chip having chip pads on a first surface and having first and second side surfaces opposite to each other and third and fourth side surfaces opposite to each other, a molding member covering the third and fourth side surfaces and exposing the first and second side surfaces of the semiconductor chip, a redistribution wiring layer on a lower surface of the molding member to cover the first surface of the semiconductor chip and including a plurality of redistribution wirings electrically connected to the chip pads, and outer connection members arranged in a connection region defined on an outer surface of the redistribution wiring layer and electrically connected to the redistribution wirings.