Invention Grant
- Patent Title: Single wafer processing environments with spatial separation
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Application No.: US16171785Application Date: 2018-10-26
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Publication No.: US11894257B2Publication Date: 2024-02-06
- Inventor: Michael Rice , Joseph AuBuchon , Sanjeev Baluja , Mandyam Sriram
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; C23C16/44 ; C23C16/458 ; H01L21/67 ; C23C16/46 ; H01L21/683 ; C23C16/455
Abstract:
Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition.
Public/Granted literature
- US20190131167A1 Single Wafer Processing Environments With Spatial Separation Public/Granted day:2019-05-02
Information query
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